Vapor Phase Soldering (also Known as “Vapor Condensation”) is one of the most Reliable Systems for Soldering Electronic Boards.

Vapor phase soldering ensures excellent temperature uniformity.

It proves to be the best technology for soldering complex components such as BGA, QFP, QFN, POP etc., in densely populated boards with a wide variety of components.

Additionally, vapor phase soldering is particularly effective in soldering devices where power dissipation is necessary (for example, power LED diodes, D2PACK or D3PACK) as the presence of voids (air bubbles) in the solder is significantly reduced with Vapor Phase technology.

Prime, in undertaking this important journey, partnered with one of the world’s leading companies, the German company ASSCON.

Description of the Vapor Phase Soldering Process

The Vapor Phase or “Vapor Condensation” soldering process involves bringing an inert fluid to boiling point, which creates a “vapor curtain” (zone) where our “assembly”, after a pre-heating phase, will remain to be soldered extremely uniformly for the time strictly necessary. The thermal transfer from vapor to board occurs during the condensation phase. This process is slightly longer than conventional air systems, requiring between 6 and 7 minutes compared to the “traditional” 5 minutes of Air systems.

What are the Advantages of Soldering a Board with Vapor Phase Soldering Technology?

• Vapor Phase soldering is extremely reliable and encompasses numerous advantages compared to conventional reflow systems.
• There cannot be out-of-control “temperatures” on boards assembled with this technology, as the boiling point of the inert fluid (Galden) will reach a well-defined temperature.
• In our case, the choice was made for Galden at 230°C. The boards assembled by Prime using this technology will therefore reach a maximum of 230°C. The thermal delta between various components populating the board averages within 3 degrees Celsius, even between small components (passives) and D-PACKs.
• Thanks to the efficiency in heat transfer (the condensation principle offers up to 10 times better transfer compared to forced convection systems, whether air or nitrogen, and up to 50 times compared to infrared systems), Vapor Phase systems allow significant energy savings and very low operating costs.
• This soldering technology is not affected by component sizes, masses and weights, or different colorations of devices present on the assembly. Every component, regardless of shape, size, weight, and color, will reach approximately the same temperature!
• Absence of oxygen: Soldering in Vapor Phase means an “oxygen-free” environment (with all the associated benefits). With this technology, nitrogen is NOT applied to obtain an “inert atmosphere”, which is undoubtedly another source of significant savings.
• Absence of oxidation phenomena (As a “consequence” of the above point) allows better wettability of the joint and alloy, resulting in better solder joints with superior mechanical strength.
• Temperature at least 15/20°C lower than traditional forced convection ovens: reduces thermal stress for all components present on the board.
• No testing and creation of dedicated soldering profiles required: even the first and only prototype board, if there were only one, is soldered perfectly.
• Minimization of board delamination phenomena: processing a board at lower and more uniform temperature reduces mechanical deformations. This reduces delamination problems due to “moisture present in the circuit. (For example, moisture” present in the PCB at 245°C can exert a force of up to 40 bar, while the same moisture “trying to escape from the PCB” at 230°C exerts about 28).
• Repeatability, uniformity, and homogeneity of soldering temperature (Absence of shadow effects).