In SMT Assembly, Currently the most Difficult Component to Assemble is the BGA Package on Package (BGA PoP).
The BGA PoP is simply the “assembly of 2 or more BGAs stacked on top of each” other.
The assembly of a BGA PoP can be seen as a very delicate and complicated technique, but it can bring interesting advantages:
- Reduction of required SMT assembly space; With BGA PoP, the assembly space of an electronic board is significantly reduced. In fact, this component is widely used in mobile phones or video cameras (where space is always too limited!).
- Direct connections between BGA PoPs (usually microcontroller and RAM); Assembling one BGA on top of another BGA allows direct connections between components. This is beneficial in terms of transmission speed, electron flow linearity, and elimination of parasitic impedances.
- Lower overall board complexity; With this component, the complexity of “SMT assembly increases but reduces the complexity of” board engineering. This can bring benefits in terms of potential net connection issues.
Prime Elettronica intends to assemble BGA PoPs in the coming days.
We will keep you informed about the progress of events.
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For more information, here’s the link to Wikipedia.
