Prime S.R.L. Continuously Invests in Improving the Quality of your Electronic Products. We are Now Focusing on Effectively Verifying SMD Soldering.
In recent weeks, we have been focusing on improving and enhancing our verification and inspection systems. Our goal is the effective verification of SMD soldering.
But how can we effectively verify SMD soldering on an electronic board?
Through our X-ray inspection system, we can monitor, even automatically, SMD soldering of covered components such as BGA, uBGA, QFN, and components with special cases.
We can properly verify the SMD solder joint, determining if the soldering meets IPC standards.
To globally monitor SMD soldering of electronic components, we are testing a new AOI inspection machine capable of verifying the presence of soldering and the percentage of the SMD soldering itself.
The dominant factor in ensuring excellent SMD soldering remains the method used in dispensing solder paste on the electronic board through screen printing.
Managing this phase effectively already ensures an excellent starting point for increasing SMT assembly quality.
Prime Electronics can also monitor this phase automatically by checking for short circuits or the presence of solder paste.
To all this must be added the complete management of the optimal soldering profile for each electronic board.
Our experience and technologies are helping us to better manage and optimally verify SMD soldering.
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