The X-ray technology
The growing need for miniaturization leads to use components more and more complex such as BGA, CSP , QFN, uBGA.
To able to check effectively the correct soldering of these components is sometimes necessary to use the X-ray techonology.
This is why, when we are in the presence of this components,that do not have the pin on sight, we have the ability to do an X-ray test.
Grazie a questo test siamo in grado di capire se tali componenti si sono saldati correttamente.
With this test we can determine whether these components are welded properly. With this test we cn also locate short circuits, pins and welded components damaged. In some cases you can even see if a component is an original version when it is suspected a falsification of it.
Thanks to our X-ray, X-SCOPE Scienscope 1800 (see the technical characteristics of the machine) we can carry out even in automatic mode.
Is possible to use macros for software-controlled ensuring a more efficient and standardization test.
It can make the 3D rendering of the weld joint.
Prime is able to ensure effective controls on more complex electronic components.
