{"id":7415,"date":"2012-04-15T15:14:01","date_gmt":"2012-04-15T13:14:01","guid":{"rendered":"https:\/\/www.primelettronica.com\/tips-information-on-how-to-optimize-printed-circuit-board-layout\/"},"modified":"2012-04-15T15:14:01","modified_gmt":"2012-04-15T13:14:01","slug":"tips-information-on-how-to-optimize-printed-circuit-board-layout","status":"publish","type":"post","link":"https:\/\/www.primelettronica.com\/en\/tips-information-on-how-to-optimize-printed-circuit-board-layout\/","title":{"rendered":"Tips  Information on how to \u201c\u201d Optimize \u201c\u201d Printed Circuit Board Layout"},"content":{"rendered":"<p style=\"text-align: justify;\">To provide useful suggestions, we want to inform you about some \u201c\u201d simple rules \u201c\u201d to keep in mind to \u201c\u201d optimize \u201c\u201d the printed circuit board layout for \u201cassembly and testing. When followed, this information\u201d\u201cplays\u201d\u201ca key role in\u201d board assembly!<br \/>\nBoth SMT and PTH (axial and\/or radial) component assembly machines, solder paste deposition systems, and testing machines always require at least 2 reference points (fiducial marks) usually positioned near the board corners &#8211; it&#8217;s important to include these.<br \/>\nThese fiducials can consist of two exposed copper dots with a 1.5 mm diameter without solder mask. (Fiducial marks can have various shapes: Squares, diamonds, circles, etc).<br \/>\nThe dimensions of printed circuit boards usually should not fall below a minimum threshold (for example, we can consider 50 mm x 50 mm). In such cases, it&#8217;s advisable to use a panel* with multiple units along both \u201cX and\u201d Y axes (* see the specification on the website or request it from our  <a class=\"mce-object\" title=\"script\" href=\"mailto:%20img%20src=\" data-wp-preserve=\"%3Cscript%20language%3D'JavaScript'%20type%3D'text%2Fjavascript'%3E%20%3C!--%20var%20prefix%20%3D%20'mailto%3A'%3B%20var%20suffix%20%3D%20''%3B%20var%20attribs%20%3D%20''%3B%20var%20path%20%3D%20'hr'%20%2B%20'ef'%20%2B%20'%3D'%3B%20var%20addy31701%20%3D%20'tecnico'%20%2B%20'%40'%3B%20addy31701%20%3D%20addy31701%20%2B%20'primelettronica'%20%2B%20'.'%20%2B%20'com'%3B%20document.write(%20'%3Ca%20'%20%2B%20path%20%2B%20'''%20%2B%20prefix%20%2B%20addy31701%20%2B%20suffix%20%2B%20'''%20%2B%20attribs%20%2B%20'%3E'%20)%3B%20document.write(%20addy31701%20)%3B%20document.write(%20'%3C%2Fa%3E'%20)%3B%20%2F%2F--%3E%20%3C%2Fscript%3E\" data-mce-placeholder=\"1\"><script language=\"JavaScript\" type=\"text\/javascript\"> <!-- document.write( '<span style='display: none;'>' ); \/\/--> <\/script>This email address is protected from spam bots. Enable Javascript to view it. <script language=\"JavaScript\" type=\"text\/javascript\"> <!-- document.write( '<\/' ); document.write( 'span>' ); \/\/--> <\/script>&#8220;<strong>technical office<\/strong> <\/a>).<br \/>\nRegarding maximum dimensions, typically, it&#8217;s best not to exceed 400 mm in X and 250 mm in Y.<br \/>\nPrime Srl, with its \u201cspecialization in certain applications, can assemble boards of\u201d\u201csignificant\u201d\u201cdimensions, up to 645 mm in X and 400 mm in Y.<br \/>\nConsider that boards and\/or panels move through\u201d machines using guide rails: therefore, it&#8217;s important to have at least 4\/5 mm clearance from components in these areas. If this isn&#8217;t possible (components too close to the edge), a rail strip must be provided. (Often by properly optimizing the panel layout, you can avoid adding rail strips to the board, saving costs &#8211; consult our    <a class=\"mce-object\" title=\"script\" href=\"mailto:%20img%20src=\" data-wp-preserve=\"%3Cscript%20language%3D'JavaScript'%20type%3D'text%2Fjavascript'%3E%20%3C!--%20var%20prefix%20%3D%20'mailto%3A'%3B%20var%20suffix%20%3D%20''%3B%20var%20attribs%20%3D%20''%3B%20var%20path%20%3D%20'hr'%20%2B%20'ef'%20%2B%20'%3D'%3B%20var%20addy11690%20%3D%20'tecnico'%20%2B%20'%40'%3B%20addy11690%20%3D%20addy11690%20%2B%20'primelettronica'%20%2B%20'.'%20%2B%20'com'%3B%20document.write(%20'%3Ca%20'%20%2B%20path%20%2B%20'''%20%2B%20prefix%20%2B%20addy11690%20%2B%20suffix%20%2B%20'''%20%2B%20attribs%20%2B%20'%3E'%20)%3B%20document.write(%20addy11690%20)%3B%20document.write(%20'%3C%2Fa%3E'%20)%3B%20%2F%2F--%3E%20%3C%2Fscript%3E\" data-mce-placeholder=\"1\"><script language=\"JavaScript\" type=\"text\/javascript\"> <!-- document.write( '<span style='display: none;'>' ); \/\/--> <\/script>This email address is protected from spam bots. Enable Javascript to view it. <script language=\"JavaScript\" type=\"text\/javascript\"> <!-- document.write( '<\/' ); document.write( 'span>' ); \/\/--> <\/script>&#8220;<strong>technical office<\/strong> <\/a>).<br \/>\nWhen possible, keep SMT components for modules that can only be soldered once, and PTH on one side.<br \/>\nIf this isn&#8217;t possible, place active SMT components and PTH on one side and passive SMT components on \u201cthe other; this will still allow wave soldering of the board.<br \/>\nIn this regard, it&#8217;s important to properly size the pads on the passive side and ensure all components are in the same direction, being careful to avoid\u201d shadow areas. (Consult our   <a class=\"mce-object\" title=\"script\" href=\"mailto:%20img%20src=\" data-wp-preserve=\"%3Cscript%20language%3D'JavaScript'%20type%3D'text%2Fjavascript'%3E%20%3C!--%20var%20prefix%20%3D%20'mailto%3A'%3B%20var%20suffix%20%3D%20''%3B%20var%20attribs%20%3D%20''%3B%20var%20path%20%3D%20'hr'%20%2B%20'ef'%20%2B%20'%3D'%3B%20var%20addy38635%20%3D%20'tecnico'%20%2B%20'%40'%3B%20addy38635%20%3D%20addy38635%20%2B%20'primelettronica'%20%2B%20'.'%20%2B%20'com'%3B%20document.write(%20'%3Ca%20'%20%2B%20path%20%2B%20'''%20%2B%20prefix%20%2B%20addy38635%20%2B%20suffix%20%2B%20'''%20%2B%20attribs%20%2B%20'%3E'%20)%3B%20document.write(%20addy38635%20)%3B%20document.write(%20'%3C%2Fa%3E'%20)%3B%20%2F%2F--%3E%20%3C%2Fscript%3E\" data-mce-placeholder=\"1\"><script language=\"JavaScript\" type=\"text\/javascript\"> <!-- document.write( '<span style='display: none;'>' ); \/\/--> <\/script>This email address is protected from spam bots. Enable Javascript to view it. <script language=\"JavaScript\" type=\"text\/javascript\"> <!-- document.write( '<\/' ); document.write( 'span>' ); \/\/--> <\/script>&#8220;<strong>technical office<\/strong> <\/a>).<br \/>\nAvoid vias passing through pads (place the via next to the pad): this also acts as an escape route for solder paste.<br \/>\nEnsure access to all areas of the board where manual soldering and\/or rework may be required.<\/p>\n<p style=\"text-align: justify;\">We would now like to present some \u201c\u201d suggestions \u201c\u201d to ensure that the board can be easily \u201c\u201d tested \u201c\u201d by flying probe systems.<br \/>\nOur test system consists of 4 independent flying probes capable of performing in-circuit, functional, and visual testing on any type of electronic board.<br \/>\nFor accurate data measurement, the machine&#8217;s probes (needles) need proper contact with the board&#8217;s test points.<br \/>\nThe following are simple guidelines that, when considered during PCB development, provide valuable support for automatic testing in terms of reliability, without increasing costs.<br \/>\nTo achieve good test coverage of the board, ensure that every single circuit polygon to be tested is accessible by the flying probes. For this purpose, position test points on the same side when possible (which will be the testing side). <\/p>\n<p style=\"text-align: justify;\">Test point characteristics:<br \/>\nThe best contact points for flying probes are:<br \/>\n&#8211; test pads free from solder resist, via holes, through-hole component leads (PTH), SMD component pads.<br \/>\n&#8211; the minimum test point size is \u201c7 mils (12 mils recommended), with a spacing of 16 mils between points (20 mils recommended).<br \/>\n&#8211; Via holes must have a minimum diameter of 12 mils (16 mils recommended), must always be occluded and not covered by solder resist.<br \/>\n&#8211; If testing with mobile capacitive probe is planned, position all integrated circuits on the same side if possible.<br \/>\n&#8211; Position any mechanical components (heat sinks, supports) so they don&#8217;t prevent \u201cthe possible placement of fixed probes on the opposite side to the test side. (For example, if we want to bring two power supplies to a specific area using two fixed probes)<br \/>\n&#8211; For SMD components, especially those with pitch less than 25 mils, make the solder pad slightly longer than the component pin so that the test equipment&#8217;s probe can contact the test point on the solder pad itself rather than on the\u201d pin.<br \/>\n&#8211; When creating the board&#8217;s electrical schematic, include signal names even for unconnected component pins to enable testing.<br \/>\n&#8211; If the CAD allows, assign a test channel number to each polygon during board development.<br \/>\n&#8211; Provide two signal names on the same polygon when dealing with resistors less than 100 ohms.<\/p>\n<p style=\"text-align: justify;\">If board power-up testing is planned:<br \/>\nI. The best way to connect the board&#8217;s power and ground points to the system&#8217;s power supplies is through a connector. If the board design doesn&#8217;t include this solution, two pads on the opposite side to the test side are used, which must have the characteristics described below.<br \/>\nII. Power and ground pads must be sufficiently large (min. 2 x 2 mm) to allow easy positioning of fixed power points. They must also be at least 4 cm apart to accommodate magnetic retention test probes with a 2 cm diameter metal base.<br \/>\nIII. Always assign the same channel numbers to power and ground points, even on different boards, to quickly identify these points (especially during program debugging).<br \/>\nCapacitors<br \/>\nDon&#8217;t assign the same component name to electrolytic and ceramic capacitors. Having two different names allows associating two different test macros during test program development.     <\/p>\n<table border=\"0\" align=\"center\">\n<tbody>\n<tr>\n<td width=\"343\">Polarized Capacitors:<\/td>\n<td width=\"352\">Transistor<\/td>\n<\/tr>\n<tr>\n<td>\n<table border=\"1\">\n<tbody>\n<tr>\n<td width=\"27\">PIN<\/td>\n<td width=\"157\">NAME<\/td>\n<\/tr>\n<tr>\n<td>1<\/td>\n<td>Positive Pin<\/td>\n<\/tr>\n<tr>\n<td>2<\/td>\n<td>Negative Pin<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/td>\n<td>\n<table border=\"1\">\n<tbody>\n<tr>\n<td width=\"27\">PIN<\/td>\n<td width=\"157\">NAME<\/td>\n<\/tr>\n<tr>\n<td>1<\/td>\n<td>Emitter<\/td>\n<\/tr>\n<tr>\n<td>2<\/td>\n<td>Base<\/td>\n<\/tr>\n<tr>\n<td>3<\/td>\n<td>Collector<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/td>\n<\/tr>\n<tr>\n<td>Diodes<\/td>\n<td>Zener Diodes<\/td>\n<\/tr>\n<tr>\n<td>\n<table border=\"1\">\n<tbody>\n<tr>\n<td width=\"27\">PIN<\/td>\n<td width=\"157\">NAME<\/td>\n<\/tr>\n<tr>\n<td>1<\/td>\n<td>Anode<\/td>\n<\/tr>\n<tr>\n<td>2<\/td>\n<td>Cathode<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/td>\n<td>\n<table border=\"1\">\n<tbody>\n<tr>\n<td width=\"27\">PIN<\/td>\n<td width=\"157\">NAME<\/td>\n<\/tr>\n<tr>\n<td>1<\/td>\n<td>Anode<\/td>\n<\/tr>\n<tr>\n<td>2<\/td>\n<td>Cathode<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"excerpt":{"rendered":"<p>To provide useful suggestions, we want to inform you about some \u201c\u201d simple rules \u201c\u201d to keep in mind to \u201c\u201d optimize \u201c\u201d the printed circuit board layout for \u201cassembly and testing. When followed, this information\u201d\u201cplays\u201d\u201ca key role in\u201d board assembly! Both SMT and PTH (axial and\/or radial) component assembly machines, solder paste deposition systems, [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"inline_featured_image":false,"footnotes":""},"categories":[58],"tags":[],"class_list":["post-7415","post","type-post","status-publish","format-standard","hentry","category-technical-documentation"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v28.3 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Tips Information on how to \u201c\u201d Optimize \u201c\u201d Printed Circuit Board Layout<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.primelettronica.com\/en\/tips-information-on-how-to-optimize-printed-circuit-board-layout\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Tips Information on how to \u201c\u201d Optimize \u201c\u201d Printed Circuit Board Layout\" \/>\n<meta property=\"og:description\" content=\"To provide useful suggestions, we want to inform you about some \u201c\u201d simple rules \u201c\u201d to keep in mind to \u201c\u201d optimize \u201c\u201d the printed circuit board layout for \u201cassembly and testing. When followed, this information\u201d\u201cplays\u201d\u201ca key role in\u201d board assembly! Both SMT and PTH (axial and\/or radial) component assembly machines, solder paste deposition systems, [&hellip;]\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.primelettronica.com\/en\/tips-information-on-how-to-optimize-printed-circuit-board-layout\/\" \/>\n<meta property=\"og:site_name\" content=\"Prime Elettronica\" \/>\n<meta property=\"article:published_time\" content=\"2012-04-15T13:14:01+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.primelettronica.com\/wp-content\/uploads\/2023\/10\/PRIME-60-scaled.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"1920\" \/>\n\t<meta property=\"og:image:height\" content=\"1280\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"author\" content=\"Webelett\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"Webelett\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"5 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.primelettronica.com\\\/en\\\/tips-information-on-how-to-optimize-printed-circuit-board-layout\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.primelettronica.com\\\/en\\\/tips-information-on-how-to-optimize-printed-circuit-board-layout\\\/\"},\"author\":{\"name\":\"Webelett\",\"@id\":\"https:\\\/\\\/www.primelettronica.com\\\/en\\\/#\\\/schema\\\/person\\\/edcd36ef07307660dabd671600fe0662\"},\"headline\":\"Tips Information on how to \u201c\u201d Optimize \u201c\u201d Printed Circuit Board Layout\",\"datePublished\":\"2012-04-15T13:14:01+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.primelettronica.com\\\/en\\\/tips-information-on-how-to-optimize-printed-circuit-board-layout\\\/\"},\"wordCount\":961,\"publisher\":{\"@id\":\"https:\\\/\\\/www.primelettronica.com\\\/en\\\/#organization\"},\"articleSection\":[\"Technical documentation\"],\"inLanguage\":\"en-US\"},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.primelettronica.com\\\/en\\\/tips-information-on-how-to-optimize-printed-circuit-board-layout\\\/\",\"url\":\"https:\\\/\\\/www.primelettronica.com\\\/en\\\/tips-information-on-how-to-optimize-printed-circuit-board-layout\\\/\",\"name\":\"Tips Information on how to \u201c\u201d Optimize \u201c\u201d Printed Circuit Board Layout\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.primelettronica.com\\\/en\\\/#website\"},\"datePublished\":\"2012-04-15T13:14:01+00:00\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/www.primelettronica.com\\\/en\\\/tips-information-on-how-to-optimize-printed-circuit-board-layout\\\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/www.primelettronica.com\\\/en\\\/tips-information-on-how-to-optimize-printed-circuit-board-layout\\\/\"]}]},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/www.primelettronica.com\\\/en\\\/tips-information-on-how-to-optimize-printed-circuit-board-layout\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/www.primelettronica.com\\\/en\\\/home\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Tips Information on how to \u201c\u201d Optimize \u201c\u201d Printed Circuit Board Layout\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/www.primelettronica.com\\\/en\\\/#website\",\"url\":\"https:\\\/\\\/www.primelettronica.com\\\/en\\\/\",\"name\":\"Prime Elettronica\",\"description\":\"Assemblaggio schede elettroniche\",\"publisher\":{\"@id\":\"https:\\\/\\\/www.primelettronica.com\\\/en\\\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/www.primelettronica.com\\\/en\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-US\"},{\"@type\":\"Organization\",\"@id\":\"https:\\\/\\\/www.primelettronica.com\\\/en\\\/#organization\",\"name\":\"Prime Elettronica - 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When followed, this information\u201d\u201cplays\u201d\u201ca key role in\u201d board assembly! Both SMT and PTH (axial and\/or radial) component assembly machines, solder paste deposition systems, [&hellip;]","og_url":"https:\/\/www.primelettronica.com\/en\/tips-information-on-how-to-optimize-printed-circuit-board-layout\/","og_site_name":"Prime Elettronica","article_published_time":"2012-04-15T13:14:01+00:00","og_image":[{"width":1920,"height":1280,"url":"https:\/\/www.primelettronica.com\/wp-content\/uploads\/2023\/10\/PRIME-60-scaled.jpg","type":"image\/jpeg"}],"author":"Webelett","twitter_card":"summary_large_image","twitter_misc":{"Written by":"Webelett","Est. reading time":"5 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.primelettronica.com\/en\/tips-information-on-how-to-optimize-printed-circuit-board-layout\/#article","isPartOf":{"@id":"https:\/\/www.primelettronica.com\/en\/tips-information-on-how-to-optimize-printed-circuit-board-layout\/"},"author":{"name":"Webelett","@id":"https:\/\/www.primelettronica.com\/en\/#\/schema\/person\/edcd36ef07307660dabd671600fe0662"},"headline":"Tips Information on how to \u201c\u201d Optimize \u201c\u201d Printed Circuit Board Layout","datePublished":"2012-04-15T13:14:01+00:00","mainEntityOfPage":{"@id":"https:\/\/www.primelettronica.com\/en\/tips-information-on-how-to-optimize-printed-circuit-board-layout\/"},"wordCount":961,"publisher":{"@id":"https:\/\/www.primelettronica.com\/en\/#organization"},"articleSection":["Technical documentation"],"inLanguage":"en-US"},{"@type":"WebPage","@id":"https:\/\/www.primelettronica.com\/en\/tips-information-on-how-to-optimize-printed-circuit-board-layout\/","url":"https:\/\/www.primelettronica.com\/en\/tips-information-on-how-to-optimize-printed-circuit-board-layout\/","name":"Tips Information on how to \u201c\u201d Optimize \u201c\u201d Printed Circuit Board Layout","isPartOf":{"@id":"https:\/\/www.primelettronica.com\/en\/#website"},"datePublished":"2012-04-15T13:14:01+00:00","breadcrumb":{"@id":"https:\/\/www.primelettronica.com\/en\/tips-information-on-how-to-optimize-printed-circuit-board-layout\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.primelettronica.com\/en\/tips-information-on-how-to-optimize-printed-circuit-board-layout\/"]}]},{"@type":"BreadcrumbList","@id":"https:\/\/www.primelettronica.com\/en\/tips-information-on-how-to-optimize-printed-circuit-board-layout\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.primelettronica.com\/en\/home\/"},{"@type":"ListItem","position":2,"name":"Tips Information on how to \u201c\u201d Optimize \u201c\u201d Printed Circuit Board Layout"}]},{"@type":"WebSite","@id":"https:\/\/www.primelettronica.com\/en\/#website","url":"https:\/\/www.primelettronica.com\/en\/","name":"Prime Elettronica","description":"Assemblaggio schede elettroniche","publisher":{"@id":"https:\/\/www.primelettronica.com\/en\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.primelettronica.com\/en\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"},{"@type":"Organization","@id":"https:\/\/www.primelettronica.com\/en\/#organization","name":"Prime Elettronica - 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